Automatic Dipping Line【Thin Adhesive Board】【Dipping machine】【MLCC End-Sealing】
Due to the small differences in different specifications, the detailed data of the equipment can be consulted by email to our account manager
Category:
Hotline: +8618948669375
WeChat: lixing18948669375
Our fully automatic end-sealing machine consists of the following components: 1. Automatic product implantation → Automatic dipping on the first side → Automatic drying on the first side → Automatic turning of the product → Automatic end-sealing on the second side → Automatic drying on the second side → Automatic unloading of the product （Consists of seven processes）
This automated production line is suitable for a variety of electronic components, including Multilayer Ceramic Capacitors (MLCC), Multilayer Chip Inductors (MLCI), Chip Resistors (CHIP R), Chip Thermistors (CHIP NTC), and Self-Recovering Fuses, among others. It encompasses a range of processes from end sealing and dipping to Surface-Mount Device (SMD) assembly.
Technical specifications:
Applicable pallet size: 280X180mm
Applicable product specifications: 0402-0603
Feeding rate: 97%
Continuous single board efficiency:≤30S/board
Equipment size: 10800*1450*2100
Board Hole Count: Depending on the component specifications, the board hole count is 18,128 for 0402 and 10,432 for 0603, meeting the needs of mass production.
Leveling Platform Precision:Controlled within ±10 micrometers, ensuring the accuracy of the implantation process.
Scraper Blade Flatness:Precision up to ±5 micrometers, guaranteeing the flatness and consistency of component implantation.
Immersion Paste Table Precision:Also controlled within ±5 micrometers, providing assurance for precise paste processing.
Paste Plate and Table Relative Parallelism: Precision up to ±5 micrometers, ensuring the even distribution of paste and correct implantation of components.
Application Products
Our equipment is capable of performing a wide range of electronic component manufacturing processes, including MLCG, MBG, NTC, Filter, Fuse and LTCC.
MLCC
MLCI
NTC
Filter
Fuse
LTCC
- Description
- Region 2
- Region 1
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- Commodity name: Automatic Dipping Line【Thin Adhesive Board】【Dipping machine】【MLCC End-Sealing】
- Product Type: Full-automatic production line
- Consumables Board: Thick Silicone End Plate
- Product Specification: large size
- Automatic production line accessories: Capacitors
- End Sealer + Drying Oven: Automatic dryer
- End Sealer + Manual Auxiliary: Manual implanter
This automatic line： Automatic product insertion → Automatic end-sealing of the first side → Automatic drying of the first side → Automatic flipping → Automatic end-sealing of the second side → Automatic drying of the second side → Automatic product unloading (7 machines connected) Customizable to meet current customer needs through modular modifications
Product name
Fully automatic sealing line for thick silicone panel
Suitable for carrier plate specifications 280mm x 178mm Rubber Plate
Applicable product specifications Imperial 0805 to 1812
Product feeding rate 97%
Efficiency of continuous single plate mode ≤30 seconds per plate
This equipment automatically plants the product into the guide plate in an oscillating manner and accurately presses the product into the holes of the thick rubber plate using a press.
Before sealing the ends, the product is uniformly leveled through a servo leveling mechanism to ensure consistent protrusion length of each chip, resulting in good consistency of the product's end seals.
The face-changing machine uses a plate replacement method for product end conversion, reducing the end damage caused during face changing and also extending the life of the press needles.
Equipped with automatic pulp addition and digital control of pulp height, the machine has a slurry spreading and line detection alarm function during spreading.
The press, leveling platform, end sealing platform, and face-changing unloading platform are equipped with detection sensors at each corner to prevent breaking the needle due to residual products on the plate surface and affecting the end seal quality of the product.
The drying oven uses a five-temperature zone hot air circulation Ferris wheel rotation method for drying, characterized by large capacity, uniform heating, quick drying, and high precision temperature control. The entire line is equipped with a return rack mechanism, allowing the thick rubber plate to be returned to the implant machine after unloading and cleaning off the impurities on the plate surface without manual intervention.
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Our fully automatic end-sealing machine consists of the following components: 1. Automatic product implantation → Automatic dipping on the first side → Automatic drying on the first side → Automatic turning of the product → Automatic end-sealing on the second side → Automatic drying on the second side → Automatic unloading of the product （Consists of seven processes）
This automated production line is suitable for a variety of electronic components, including Multilayer Ceramic Capacitors (MLCC), Multilayer Chip Inductors (MLCI), Chip Resistors (CHIP R), Chip Thermistors (CHIP NTC), and Self-Recovering Fuses, among others. It encompasses a range of processes from end sealing and dipping to Surface-Mount Device (SMD) assembly.
Technical specifications:
Applicable pallet size: 280X180mm
Applicable product specifications: 0402-0603
Feeding rate: 97%
Continuous single board efficiency:≤30S/board
Equipment size: 10800*1450*2100
Board Hole Count: Depending on the component specifications, the board hole count is 18,128 for 0402 and 10,432 for 0603, meeting the needs of mass production.
Leveling Platform Precision:Controlled within ±10 micrometers, ensuring the accuracy of the implantation process.
Scraper Blade Flatness:Precision up to ±5 micrometers, guaranteeing the flatness and consistency of component implantation.
Immersion Paste Table Precision:Also controlled within ±5 micrometers, providing assurance for precise paste processing.
Paste Plate and Table Relative Parallelism: Precision up to ±5 micrometers, ensuring the even distribution of paste and correct implantation of components.
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Due to the small differences in different specifications, the detailed data of the equipment can be consulted by email to our account manager
Key words:
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